TOYO Clean Modules cover three core series, all of which have achieved standardized mass production:
GCH Series: Rail-Embedded Ball Screw Modules. They can reach CLASS 1 cleanliness when connected to an external vacuum source, making them the first choice for semiconductor equipment.
ECB Series: Clean Belt Modules. They offer a maximum cleanliness level of CLASS 10, with a stroke of up to 3050mm and a load capacity of 25kg, serving as the mainstream option in electronic manufacturing.
ECH Series: Clean Rail-Embedded Modules. Suitable for precision positioning and handling, they are applied in the semiconductor and FPD industries.
Low Particle Emission Design: A special sealing structure prevents internal lubricant leakage.
Modular Design: Compatible with mainstream servo motors on the market, supporting quick replacement.
High-Precision Positioning: The repeatability of the ball screw series reaches ±0.003mm, and that of the linear motor series reaches ±0.002mm.
Long Service Life: Key components have a designed service life of 18 months, reducing maintenance costs.
Built-in IoT Sensors: Real-time monitoring of temperature, vibration, and load to enable predictive maintenance and reduce downtime risks.
AI Algorithm Integration: Optimization of motion trajectories to improve efficiency by 15-20% while reducing energy consumption.
Data Visualization: Data transmission to the central control system via Bluetooth/WiFi to realize remote monitoring and fault early warning.
Ultra-Clean Upgrade: The GCH Series will be upgraded to CLASS 0.1 to meet the needs of advanced semiconductor processes.
Miniaturization and Lightweight: The volume of the new-generation products will be reduced by 30% and the weight by 25%, adapting to compact production lines.
High Speed and High Load: The maximum speed of the ECB Series will exceed 3m/s, the load capacity will be increased to 35kg, while maintaining 0.01mm-level precision.
In-House Production of Core Components: The self-manufacturing rate of ball screws and guide rails will be increased to 85%, reducing costs by 20% and shortening lead times.
Green Manufacturing: Adoption of low-VOC materials to reduce energy consumption by 18%, complying with EU CE certification standards.
Standardized Modules: Transition from customization to standardization, shortening the delivery cycle from 45 days to 15 days and reducing costs by 30%.
Develop dedicated modules for advanced processes of 28nm and below, and have obtained test orders from SMIC and TSMC.
Collaborate with semiconductor equipment manufacturers to develop integrated solutions and provide one-stop services.
Chinese Market: Expand production bases in East China and South China, establish a technology center in North China, and cover semiconductor industry clusters.
Southeast Asia: Set up an assembly plant in Vietnam to serve the local electronic manufacturing and new energy industries.
North America: Collaborate with local agents to expand the panel and medical equipment markets, and have obtained orders from 3 customers.
New Strategic Customers: Target to develop 10 leading enterprises in the industry, and have reached cooperation intentions with 2 so far.
Customer Tier Upgrade: Increase the proportion of Class A customers (with annual procurement volume > 5 million RMB) from 15% to 25%.
Service Upgrade: Launch an integrated service package of "Module + Maintenance + Data" to increase customer stickiness by 30%.
Increased R&D Investment: Raise R&D investment from 5% to 8% of revenue, focusing on breakthroughs in magnetic levitation drive and C5-level ball screw grinding technology.
Technical Collaboration with Japan: Deepen technical exchanges with the parent company, introduce precision manufacturing processes, and improve product reliability.
Patent Layout: Add 15 new patents in 2026, focusing on dust-proof structures and intelligent control algorithms.
Economies of Scale: Through standardized production, increase the production capacity of a single model by 50% and reduce unit costs by 22%.
Supply Chain Optimization: Localize the procurement of key components to reduce import dependence and lower logistics costs by 12%.
Production Automation: Introduce robotic assembly lines to improve production efficiency by 40% and reduce labor costs by 25%.
"Clean + Intelligent" Integrated Solutions: The first in the industry to provide clean modules with built-in IoT, with 3 customer application cases obtained.
Rapid Customization Response: Small-batch customization based on standard products, with delivery time controlled within 21 days.
Full-Lifecycle Services: Provide one-stop services from model selection and installation to predictive maintenance, improving customer satisfaction by 20%.
Revenue Growth: The clean module business will grow by 40% to reach 320 million RMB.
Market Share: Increase the market share in the segmented market of clean modules for semiconductors and display panels to 12%.
Gross Profit Margin: Raise the gross profit margin to 38% (32% in 2025) through technological upgrades and cost control.
Countermeasure: Strengthen technical barriers, develop exclusive patented technologies, and enhance product added value instead of engaging in simple price competition.
Countermeasure: Establish a second production base in Southeast Asia to reduce dependence on a single region and ensure supply security.
Countermeasure: Establish a modular product platform to realize a flexible production model of "standard + customization" and shorten the delivery cycle.
In 2026, TOYO Clean Modules will focus on the three core development directions of "intelligence, ultra-cleanliness, and high efficiency". Through technological innovation and in-depth market development, it will consolidate its leading position in high-end manufacturing industries such as semiconductors and display panels. With the upgrading of China's manufacturing industry and the eastward shift of the global semiconductor industry, TOYO Clean Modules is expected to usher in a new round of high-speed growth from 2026 to 2028 and become a hidden champion in the field of industrial automation.
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